JPH0639481Y2 - 印刷回路基板 - Google Patents
印刷回路基板Info
- Publication number
- JPH0639481Y2 JPH0639481Y2 JP1989037387U JP3738789U JPH0639481Y2 JP H0639481 Y2 JPH0639481 Y2 JP H0639481Y2 JP 1989037387 U JP1989037387 U JP 1989037387U JP 3738789 U JP3738789 U JP 3738789U JP H0639481 Y2 JPH0639481 Y2 JP H0639481Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- holes
- rigid
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002131 composite material Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989037387U JPH0639481Y2 (ja) | 1989-03-30 | 1989-03-30 | 印刷回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989037387U JPH0639481Y2 (ja) | 1989-03-30 | 1989-03-30 | 印刷回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02129762U JPH02129762U (en]) | 1990-10-25 |
| JPH0639481Y2 true JPH0639481Y2 (ja) | 1994-10-12 |
Family
ID=31544445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989037387U Expired - Lifetime JPH0639481Y2 (ja) | 1989-03-30 | 1989-03-30 | 印刷回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639481Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008151589A (ja) * | 2006-12-15 | 2008-07-03 | Ricoh Elemex Corp | 携帯時計、および携帯時計用回路基板 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358422A (ja) * | 2000-06-13 | 2001-12-26 | Sony Corp | 電子回路装置 |
| CN102150481A (zh) * | 2008-09-09 | 2011-08-10 | 富士通株式会社 | 多层柔性印刷电路布线基板及电子装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0265377U (en]) * | 1988-11-04 | 1990-05-16 |
-
1989
- 1989-03-30 JP JP1989037387U patent/JPH0639481Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008151589A (ja) * | 2006-12-15 | 2008-07-03 | Ricoh Elemex Corp | 携帯時計、および携帯時計用回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02129762U (en]) | 1990-10-25 |
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